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Kandou caps off series C round

Nov 19, 2020 • Robert Lavine

EPFL’s chip-link technology provider has added more than $36m to a Swisscom-backed round that now totals $92.3m, taking its total funding to almost $133m.

Kandou, a Switzerland-based chip-link technology spinout of EPFL, completed a $92.3m series C round that included telecommunications firm Swisscom on Tuesday.
New and existing investors including the Swiss Select Opportunities fund managed by Natixis Investment Managers’ Flexstone Partners subsidiary, and venture capital firms Bessemer Venture Partners (BVP) and Climb Ventures added $36.3m in new funding.
Swisscom’s Digital Transformation Fund and Swisscom Ventures units joined BVP, Columbia Lake Partners, Fayerweather Capital Partners, Forestay Capital, Kreos Capital, Raging Capital and…

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