Every day, Global University Venturing rounds up the smaller investments from across the university innovation ecosystem in its deal net.

Mlink, a China-based internet-of-things semiconductor technology developer backed by Tsinghua University, raised RMB100m ($15m) in a series B-plus round led by Beijing Integrated Circuit Chip Fund yesterday, according to DealStreetAsia. SIG Capital, Yangtze River Industry Fund, Enlight Growth Partners and Sichuan Entrepreneur Fund also took part in the round. The company secured a “similar-sized” series…

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